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| ESDLIN1524BJ TRANSILTM diode for ESD protection Features Max peak pulse power 160 W (8/20 s) Asymmetrical bidirectional device Stand-off voltage: 15 and 24 V Low clamping factor VCL/VBR Complies with the following standards : - IEC 61000-4-2 level 4 (> 15 kV air discharge, > 8 kV contact discharge) - IEC 61000-4-5; Ipp= 3 A (8/20 s) - HBM MIL STD 833, class 3 (> 4 kV) Low Leakage current 2 1 SOD-323 Configuration Description The ESDLIN1524BJ is an asymmetrical TRANSIL diode designed specifically for protecting one automotive LIN bus line against electrostatic discharge (ESD). The SOD-323 is a very small package which allows space saving on high density printed circuit board . Transil diodes provide high overvoltage protection by clamping action and have instantaneous response to transient overvoltages. Table 1. Symbol PPP Tstg Tj TL 1 21 2 Pin 1 2 Description Cathode 1 (15 V reverse stand-off voltage) Cathode 2 (24 V reverse stand-off voltage) Absolute maximum ratings (limiting values) Tamb = 25 C Parameter Peak pulse power dissipation 8/20 s Storage temperature range Operating junction temperature range Maximum lead temperature for soldering during 10 s (1) Value Tj initial = Tamb 160 -65 to +175 -40 to 150 260 Unit W C C 1. For a surge greater than maximum values, the diode will fail in short-circuit Table 2. Symbol ESD ESD Maximum ratings Parameter Electrostatic discharge capability Conditions IEC 61000-4-2 (contact discharge) HBM MIL STD 833 Value 23 10 Unit kV TM: TRANSIL is a trademark of STMicroelectronics. September 2006 Rev 2 1/7 www.st.com 7 Characteristics ESDLIN1524BJ 1 Table 3. Symbol VRM VBR VCL IRM IR IPP C Characteristics Electrical characteristics (Tamb = 25 C) Parameter Stand-off voltage Breakdown voltage Clamping voltage V C LV B R V R M I R IM R IM R I R V V R MV B R V C L I I PP Leakage current @ VRM Breakdown current @ VBR Peak pulse current Junction capacitance I PP IRM @VRM Types nA V Typ Max ESDLIN1524BJ(15V) ESDLIN1524BJ(24V) 1. Pulse test: tp < 50 ms 2. VR = 0 V, F= 1 MHz 3. VBR = T x (Tamb -25) x VBR(25 C) VBR @ IR (1) V mA Min Typ Max 5 5 VCL max @ IPP 8/20 s V 25 40 A 1 1 V 35 50 A C (2) pF Typ Max T(3) 10-4/C Max 8.8 1 1 50 50 15 17.1 18.9 20.3 24 25.4 27.8 30.3 5 16 3 20 9.6 Figure 1. Relative variation of peak pulse power versus initial junction temperature Figure 2. Peak pulse power versus exponential pulse duration PPP[Tj initial] / PPP [Tj initial=25C] 1.1 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 0 25 50 75 100 125 150 175 TJ(C) PPP(W) 1.E+03 Tj initial =25 C 1.E+02 tP(s) 1.E+01 1 10 100 2/7 ESDLIN1524BJ Characteristics Figure 3. Junction capacitance versus line voltage (typical values), 15 V side Figure 4. Junction capacitance versus line voltage (typical values), 24 V side C(pF) 20 18 16 14 12 10 8 6 4 2 0 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 VLINE(V) 15 V side F=1 MHz VOSC=30mVRMS TJ=25C C(pF) 20 18 16 14 12 10 8 6 4 2 0 0 2 4 6 8 10 12 14 16 18 20 22 24 VLINE(V) 24 V side F=1 MHz VOSC=30 mVRMS TJ=25 C Figure 5. Clamping test conditions and results 2 TEST BOARD 1kV ESD Air discharge Voltage probe Ground plane ESD test configuration V 500 3/7 1 V:20V/d t: 50 ns/d V:20V/d t: 50 ns/d Remaining voltage after +1 kV ESD voltage waveform (IEC 61000-4-2 conditions) Remaining voltage after -1 kV ESD voltage waveform (IEC 61000-4-2 conditions) Placement and PCB layout recommendations ESDLIN1524BJ 2 Placement and PCB layout recommendations Figure 6. illustrates recommendations for the placement and layout of the PCB for optimum benefit of the ESDLIN1524BJ. Figure 6. Placement and PCB layout recommendations LIN Node Voltage regulator Vbat Connector Gnd MCU LIN 24 LIN Transceiver 15 ESDLIN1524BJ located as close as possible to the connector With Ground wire Vbat With Ground plane Vbat Connector LIN Connector LIN GND GND 4/7 ESDLIN1524BJ Ordering information scheme 3 Ordering information scheme ESDLIN 15 ESDLIN protection Stand-off voltage 1 15 = 15 V Stand-off voltage 2 24 = 24 V Bidirectional Package J = SOD-323 24 B J 4 Package information Table 4. SOD-323 dimensions Dimensions H b E A1 Ref. Millimeters Min. Max. 1.17 0 0.25 0.1 1.52 1.11 2.3 0.1 0.1 0.1 0.44 0.25 1.8 1.45 2.7 0.46 0.41 0 Inches Min. Max. 0.046 0.004 0.017 0.01 0.071 0.057 0.106 0.02 0.016 A A1 D A b c 0.01 0.004 0.06 0.044 0.09 0.004 0.004 c Q1 D E H L L Q1 5/7 Ordering information Figure 7. SOD-323 footprint (dimensions in millimeters) 3.20 ESDLIN1524BJ 0.54 1.06 1.08 1.06 In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 5 Ordering information Part number ESDLIN1524BJ Marking 24 Package SOD-323 Weight 5 mg Base qty 3000 Delivery mode Tape and reel 6 Revision history Date 28-Aug-2006 22-Sep-2006 Revision 1 2 Initial release. Added Figure 6 Placement and layout recommendations. Changes 6/7 ESDLIN1524BJ Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST'S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER'S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. (c) 2006 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 7/7 |
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